To be effective, a heat pipe must be composed of material with high thermal conductivity, usually copper or copper alloy. The ...

The performance and reliability of high-power Naval electronics warfare systems ... cooling’ thermal management architectures restrict the removal of heat through a high-resistance pathway to the ...

Wide bandgap materials and advanced packaging are revolutionizing power, but thermal and integration challenges persist.

With a projected CAGR of 9.7% from 2025 to 2032, the market is poised to reach USD 7.5 billion by 2032. Key trends such as the rise of phase change materials, advanced cooling solutions, AI ...

The evaluation, testing, and simulation of electronic devices and systems are critical ... for enhancing the overall efficiency of thermal systems[4]. These advancements in both statistical ...

Trane – by Trane Technologies (NYSE: TT), a global climate company, announced the expansion of its thermal management systems ...

Whether improving the heat management of nanoscale devices or developing next-generation thermotronic systems ... pave the way for thermal logic devices—thermal analogs to electronic diodes ...

Heat is the single most common cause of electronic failure. Theoretically, lowering the operating junction temperature by 10° C can quadruple the life of a gadget. CVD diamond beats today’s standard ...

Gentherm (NASDAQ: THRM), the global market leader of innovative thermal management and pneumatic comfort technologies for the automotive industry and a leader in medical patient temperature management ...

Synthetic diamond specialist Element Six, part of the De Beers Group (think diamond jewelry), said more than half of all electronic device failures today are heat-related.