Solder joint reliability model vath modified Darveaux's equations for the micro smd wafer level-chip scale package family Published in: 53rd Electronic Components and Technology Conference, 2003.

Lead-free Sn-Ag-Cu materials otherwise known as SAC materials are widely used in the electronic packaging industry for its nontoxic nature unlike Sn-Pb solder materials. Electronics in the present ...

Get Baltic Exchange: Baltic Dry Index (.BADI) real-time stock quotes, news, price and financial information from Reuters to inform your trading and investments ...

May - Cool as Ice Every winter, a layer of carbon dioxide frost (dry ice) forms on the surface of Mars. At its greatest extent in midwinter, this frost reaches from the poles down to the middle ...

A quickly growing brush fire in Southern California has spread at least 2,400 acres, prompting evacuations, according to fire officials. The blaze, dubbed the Wolf Fire, was first reported around ...

This article presents the design and implementation of a robust (universal input: 85V-250VAC) Flyback power supply capable of delivering continuous 12V-DC output at 3A (36W). The converter utilizes an ...

The spot market maintains a state of "high premium and low trading volume," with SHFE tin prices trading sideways at a high level. [SMM Tin Morning News] Macro: (1) The US Congress approved ...