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Intel looks beyond silicon, outlines breakthroughs in atomically-thin 2D transistors, chip packaging, and interconnects at IEDM 2024for the nanoribbon being nearly twice as thin as the fin used in FinFET. The biggest question is, what’s next after silicon? After CFET transistors arrive, the next step of GAA is to change the ...
Intel, Samsung, TSMC and others are laying the groundwork for the transition from today’s finFET transistors to new gate-all-around field-effect transistors (GAA FETs) at the 3nm and 2nm nodes, ...
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