Intel's impressive manufacturing process capabilities and fab resources are well known throughout the industry. In fact, most would ...

X-FAB Silicon Foundries SE is building on its expertise in GaN processing technology for high-power applications by introducing GaN-on-Si foundry services for dMode devices as part of its XG035 ...

The process aims at X-Fab's core competencies in the Analog/Mixed signal and High-Voltage specialties chips market. XH035 enables the company to manufacture a broad range of devices including RF, ...

It allows the sub-fab equipment operator, fab process engineer or operations manager to have a comprehensive real-time overview of the state of the equipment, and with just a few mouse clicks ...

X-FAB Silicon Foundries has introduced GaN-on-Si foundry services for dMode devices as part of its XG035 technology platform.

Mixed-signal chip maker X-Fab Silicon Foundries is X-Fab offering a 110nm BCD-on-SoI process, claiming to be the first to do so. Called XT011, it “reflects the need for greater digital integration and ...

Industry’s lowest-mask-count modular 0.18 micrometer foundry process combines digital, analog, lowest Ron high-voltage, and embedded non-volatile memory options ERFURT, Germany, April 8, 2008 – ...

X-FAB and Exagan partner to develop robust production process for high-volume GaN-on-Silicon devices on 200mm wafers, enable such manufacturability an ...

Second 300mm facility boosts production capacity at Mie semiconductor plant Tokyo, January 11, 2006 — Fujitsu Limited today announced that it will construct a new fab to mass-produce logic ...

SK hynix is the first memory maker to assemble ASML's High-NA EUV lithography system NXE:5200B at its M16 fab in Icheon to ...

PALO ALTO, Calif. — In a move to cut costs and enable new process technologies, Agilent Technologies Inc. here disclosed plans to consolidate its wafer fab operations into a new, advanced plant in ...