Intel's impressive manufacturing process capabilities and fab resources are well known throughout the industry. In fact, most would ...

X-FAB Silicon Foundries SE is building on its expertise in GaN processing technology for high-power applications by introducing GaN-on-Si foundry services for dMode devices as part of its XG035 ...

The U.S. will revoke TSMC’s special export license for its Nanjing Fab 16 by the end of 2025, potentially disrupting its 16nm ...

It allows the sub-fab equipment operator, fab process engineer or operations manager to have a comprehensive real-time overview of the state of the equipment, and with just a few mouse clicks ...

The process aims at X-Fab's core competencies in the Analog/Mixed signal and High-Voltage specialties chips market. XH035 enables the company to manufacture a broad range of devices including RF, ...

X-FAB Silicon Foundries has introduced GaN-on-Si foundry services for dMode devices as part of its XG035 technology platform.

Mixed-signal chip maker X-Fab Silicon Foundries is X-Fab offering a 110nm BCD-on-SoI process, claiming to be the first to do so. Called XT011, it “reflects the need for greater digital integration and ...

Industry’s lowest-mask-count modular 0.18 micrometer foundry process combines digital, analog, lowest Ron high-voltage, and embedded non-volatile memory options ERFURT, Germany, April 8, 2008 – ...

X-FAB and Exagan partner to develop robust production process for high-volume GaN-on-Silicon devices on 200mm wafers, enable such manufacturability an ...

PALO ALTO, Calif. — In a move to cut costs and enable new process technologies, Agilent Technologies Inc. here disclosed plans to consolidate its wafer fab operations into a new, advanced plant in ...

Second 300mm facility boosts production capacity at Mie semiconductor plant Tokyo, January 11, 2006 — Fujitsu Limited today announced that it will construct a new fab to mass-produce logic ...